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Advanced Packaging International 2026

Amkor Technology is excited to participate in Advanced Packaging International 2026, taking place April 20–22, 2026, at the Sheraton Brussels Airport Hotel in Brussels, Belgium.

Eoin O’Toole, Research and Development Director at Amkor Technology, will present “Supporting the European Advanced Packaging Ecosystem in HVM and Innovation” on Tuesday, April 21, at 2:00 p.m. CET.

The presentation will explore the growing need for alternative semiconductor supply chains and highlight how Amkor Technology Portugal (ATEP), Europe’s largest advanced packaging OSAT, supports Europe‑centric foundry advances through high‑volume manufacturing capabilities, a broad portfolio of advanced packaging technologies, and its innovative Hybrid Panel Technology, enabling die‑first and die‑last fan‑out solutions.

Amkor looks forward to engaging with customers and industry partners at Advanced Packaging International 2026 to discuss how its European manufacturing capabilities and advanced packaging technologies support resilient supply chains and next‑generation semiconductor solutions.