Careers – Malaysia

Job Responsibilities:

• Develop and implement strategies to optimize facility layout and utilization
• Analyze space usage and identify improvement opportunities
• Performed capacity time study and line balancing for the overall site
• Analyzed and simulated capacity capability for Ramp-Up projects
• Lead operation team for machine utilization increment projects
• Lead IE and Automation team for data and reporting automatization projects
• Responsible for analyzing and monitoring the site’s data accuracy
• Collaborated with the R&D & Finance team in simulating new business equipment and tool requirements

Qualifications:

• Candidate must possess at least a Degree in Engineering or equivalent
• At least 3 years of working experience in the related fast-paced manufacturing environment is required for this position
• Knowledge in layout and capacity planning, utilization analysis and IE improvement tools as an added advantage
• Proficient in AutoCAD and Microsoft Office (Excel, PowerPoint)
• Organized, systematic with excellent attention to detail and good at problem-solving
• Fresh graduates are encouraged to apply
• Applicants must be willing to work in Telok Panglima Garang (FIZ), Selangor

Interested candidates can send their CV to Recruitment@amkor.com

Job Responsibilities:

• Plan, lead and manage package and process improvement and development activities
• Review customers’ new product spec requirements and follow up implementation where applicable
• Research, evaluate and propose materials and equipment suitable to support new product development
• Study and identify department staff’s technical skill requirements
• Effectively communicate company /department direction to respective staff in the department
• Follow up department staff’s compliance on quality, environmental, safety and health programs and activities in the company
• Performs any other functions and activities as may be assigned by supervisor from time to time

Qualifications:

• Candidate should possess at least a Masters/Bachelor’s Degree in Engineering (Mechanical/Electrical/Electronics/Microelectronics/Mechatronics/Semiconductor Technology, Material science) or equivalent
• Preferably more than 10 years in semiconductor backend (FOL & EOL) manufacturing/NPI/process & package development experience
• Experienced in lead frame/power packaging design and technology
• Experienced in semiconductor backend material, equipment, process & package development & project management
• Familiar with the common equipment/technology in the industry and possess good knowhow of the equipment features for new package development
• Design/simulation/FA hands-on experience will be an added advantage
• Good in critical thinking and systematic problem-solving skills e.g. DOE, 8D, DMAIC, Process Mapping, FTA, 5-Why, Fish Bond, IS-IS NOT, etc.
• Good leadership, written and verbal presentation skills in English. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings
• Applicants must be willing to work in Telok Panglima Garang (FIZ), Selangor

Interested candidates can send their CV to Recruitment@amkor.com

Job Responsibilities:

• Source materials and equipment that meet the required quality standards at the most competitive prices
• Negotiate with suppliers and lead cost-reduction initiatives to achieve defined cost-saving targets
• Develop and execute material requirement planning (MRP) to ensure timely and uninterrupted supply of materials
• Oversee inventory management to maintain optimal stock levels while minimizing excess and obsolescence
• Manage vendor relationships, including conducting audits, evaluating performance, and driving continuous improvement programs
• Collaborate with the business development team to support new projects from a procurement perspective
• Oversee Supplier Product Change Notifications (SPCN) to ensure smooth transitions and minimal impact on production
• Lead and mentor the procurement team to achieve departmental KPIs and contribute to overall company goals

Qualifications:

• A Bachelor’s Degree in Engineering or a related field is required
• Minimum of 10 years of relevant procurement experience, preferably within the Semiconductor OSAT or multinational corporation (MNC) environment
• Proven expertise in vendor management with excellent communication and relationship-building skills
• Proficient in SAP, particularly in the Materials Management (MM) module
• Strong negotiation skills with a demonstrated track record of successful cost-reduction strategies
• In-depth knowledge of material requirement planning (MRP) and inventory management best practices
• Strong analytical skills and a high level of numerical proficiency
• Proficient in Microsoft Office, particularly Excel and PowerPoint
• Highly organized, systematic, and detail-oriented with strong problem-solving abilities
• Willingness to work in Telok Panglima Garang (FIZ), Selangor

Interested candidates can send their CV to Recruitment@amkor.com

Job Responsibilities:

• Managing the execution of the new package development project according to business process guidelines, to meet project milestones, quality & cost requirements
• Plan, organize and control the project with full responsibility for all operational decisions in the project
• Responsible for Engineering Samples, Qualification and safe launch builds, and proper handover to manufacturing
• Break down the project complexity to transparently report the status of the project to the project owner, and upper management and diligently to customers
• Prepare respective business cases and forward-looking risk assessments timely to facilitate management decisions and consequence management
• Responsible for overseeing customer audits and all issues related to the projects. Communicate effectively to gain support from all stakeholders

Qualifications:

• Minimum 3 years working experience as Project Leader in Semiconductor Package Development
• Broad knowledge of overall Semiconductor FOL and EOL manufacturing processes
• Familiar with the development of Power packages (PQFN, TOLL, LFPAK, etc) an added advantage
• Excellent Project Management, Organizational and Interpersonal Skills in managing semiconductor new package development projects
• Ability to prioritize multiple activities and make effective decisions in support of a compact project plan, using sound communication skills, influencing power and negotiation skills both internally and externally with all stakeholders
• Good written and verbal presentation skills. Able to present ideas, concepts, data and plans with high confidence at team meetings and executive review meetings
• Applicants must be willing to work in Telok Panglima Garang (FIZ), Selangor

Education:

• Bachelor’s or Master’s in Engineering (Mechanical, Electrical, Electronics, Microelectronics, Mechatronics, Semiconductor Technology, Material science) or equivalent.

Interested candidates can send their CV to Recruitment@amkor.com

Job Responsibilities:

• Handle abnormal lot disposition, decide on the failure analysis method, analyze the result & make judgments including establishing good communication with the customer on the lot proceeding to avoid quality risk for shipment
• Support process productivity and efficiency improvement activities
• Lead the team on internal or external auditing on responding to the relevant department, including coordinating with other department support for item closure
• Responsible for establishing, improve and maintaining manufacturing operational standard of operation (SOP) to reduce/ eliminate operation variation among the shift for better & stable manufacturing ability
• To manage Low Volume Manufacturing (LVM) for any new change introduced to the manufacturing line including preparation for the initial start to manage the risk of quality & manufacturability for the newly introduced item
• Responsible for leading improvement, maintaining Process Flow, Control Plan as well and FMEA which the input may come from risk management, improvement activities, claims, audit findings, or internal process

Qualifications:

• Minimum of 2 years working experience in the same leadership capacity with similar semiconductor manufacturing, preferably with TnF through Test process
• Preferably with experience in bringing a product from low volume to high volume production
• Able to perform independently with minimal supervision and equipped with basic knowledge of the overall semiconductor assembly process as well as an understanding of automotive requirement
• A team player with strong analytical abilities, problem-solving skills in SPC, familiarity with 8 Discipline, Why-Why Analysis and Fault Tree Analysis and DOE will be an added advantage
• Knowledge and experience in Lean Manufacturing, Six Sigma and ISO/TS standards
• Fresh graduates are encouraged to apply
• Applicants must be willing to work in Telok Panglima Garang (FIZ), Selangor

Education:

• Candidate should possess at least a Degree or Master’s in Engineering (Mechanical, Electronics, Manufacturing, or  Materials Engineering) or similar disciplines
• Fresh graduates are also encouraged to apply

Interested candidates can send their CV to Recruitment@amkor.com