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Amkor Technology proudly congratulates Michael Kelly, Vice President of Chiplets/FCBGA Integration, on receiving the esteemed William D. Ashman – John A. Wagnon Technical Achievement Award at the IMAPS Symposium 2025. This recognition marks a significant milestone in Mike’s distinguished career and underscores his enduring contributions to the microelectronics packaging industry.

Since joining Amkor in 2005, Mike has been a driving force behind some of the company’s most transformative innovations. His leadership has propelled advancements in EMI shielding, thermally enhanced packages, sensor integration, and high-density multi-chip module (MCM) packaging. His pioneering work in 2.5D TSV, Chiplets, and Amkor’s proprietary SWIFT®, S-SWIFT™, and S-Connect™ technologies has helped shape the future of semiconductor packaging—particularly in the realms of AI and high-performance computing (HPC).

With over 25 years of experience in electronics and IC package design, and more than 40 patents to his name, Mike’s technical vision and execution have left a lasting impact on the industry. His work exemplifies the spirit of innovation and collaboration that defines Amkor’s approach to solving the most complex challenges in advanced packaging.

The William D. Ashman – John A. Wagnon Award honors individuals who have made outstanding technical contributions while actively supporting the advancement of the profession. Mike’s induction as a Life Member and Fellow of the Society places him among an elite group of industry leaders whose work continues to inspire and elevate the field.

At Amkor, we celebrate this achievement not only as a recognition of Mike’s individual excellence but also as a reflection of our commitment to technical leadership, partnership, and innovation. Congratulations, Mike—your legacy continues to shape the future of microelectronics.