A revolutionary bridge die interposer technology solution
Amkor’s Silicon Connect (S-Connect) technology is a significant advancement in semiconductor packaging, offering high-performance and energy-efficient computing solutions. S-Connect integrates multiple silicon dies within a single package, enhancing performance, flexibility, and miniaturization.
This technology uses an embedded silicon bridge die for inter-chip connection, enabling high-bandwidth device-to-device interconnection. Advantages include offloading high-density routing from the High-Density Fan-out (HDFO) to the silicon bridge, extensibility to large modules, and optimal placement of integrated passive device (IPD) capacitors for improved power delivery.
Key Features
Benefits
Options
- Extended technology of proven HDFO technology (S-SWIFT)
- Bridge technology with embedded silicon-connect die for high bandwidth die-to-die interconnection
- IPD embedding for improved power delivery (PDN) and signal integrity
- S-Connect combined with interposer layers enables:
- Molded local S-Connect die (TSV: optional)
- Molded IPD close to ASIC for enhanced signal integrity
- Molded Cu tall pillar for vertical pass-through signals and power delivery
- Additional RDL for design flexibility
- Unprecedented integration: S-Connect enables the seamless integration of multiple silicon dies within a single package. Experience the convergence of CPUs, GPUs, and chiplets in a compact, high-density configuration, unlocking a new era of computing power.
- Modular design, limitless possibilities: S-Connect empowers a modular approach, allowing for the independent development of chiplets as functional blocks. Mix and match components effortlessly, customizing your computing solutions for optimal performance and functionality.
- Efficiency redefined: The thermal dissipation path is maintained out the back of the functional die, directly to a packaged lid or the final heat sink solution. Thermal interface materials (TIMs) can use conventional organic or metal Indium TIM materials for enhanced power dissipation.
- Scalable to your needs: Whether it is a power-efficient mobile device or a high-performance computing system, S-Connect scales seamlessly. This technology offers the flexibility to address diverse market needs, providing a unified platform for innovation.
- Accelerated innovation, faster to market: S-Connect accelerates innovation by streamlining the design process. Develop cutting-edge solutions faster and reuse common chiplets in multiple designs while optimizing other dies as needed.
- No TSV bridge:
- D2D interconnection focus
- 40-50 µm pitch
- Capable of high aspect ration bridge
- TSV bridge:
- ASIC + HBM integration
- >40 µm µbump pitch
- Capable of backside interconnection
- IPD attach options:
- IPD in mold
- IPD under mold
Questions?
Contact an Amkor expert by clicking the request info button below.