Packaging Chips with CHIPS: West Coast Summit
Amkor Technology, a proud sponsor, invites you to the “IEEE USA: Packaging Chips with CHIPS” event on October 17 at Skysong, ASU’s Scottsdale Innovation Center in Arizona.
David McCann, Senior Vice President and Chief of Staff – Business Units will present the Keynote on “The Future of Advanced Packaging in the United States.“
Curtis Zwenger, VP of Engineering and Technical Marketing will join the panel session “CHIPS Act and the Arizona Innovation Economy“
When: October 17, 2024
Where: Skysong, ASU's Scottsdale Innovation Center
위치: 애리조나 주 스코츠데일
또 다른 이벤트
Chiplet Summit 2025
