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Packaging Chips with CHIPS: West Coast Summit

Amkor Technology, a proud sponsor, invites you to the “IEEE USA: Packaging Chips with CHIPS” event on October 17 at Skysong, ASU’s Scottsdale Innovation Center in Arizona.

David McCann, Senior Vice President and Chief of Staff – Business Units will present the Keynote on “The Future of Advanced Packaging in the United States.“

Curtis Zwenger, VP of Engineering and Technical Marketing will join the panel session “CHIPS Act and the Arizona Innovation Economy“