Packaging Chips with CHIPS: West Coast Summit

Amkor Technology, a proud sponsor, invites you to the “IEEE USA: Packaging Chips with CHIPS” event on October 17 at Skysong, ASU’s Scottsdale Innovation Center in Arizona.

David McCann, Senior Vice President and Chief of Staff – Business Units will present the Keynote on “The Future of Advanced Packaging in the United States.

Curtis Zwenger, VP of Engineering and Technical Marketing will join the panel session “CHIPS Act and the Arizona Innovation Economy

When: October 17, 2024 Where: Skysong, ASU's Scottsdale Innovation Center 위치: 애리조나 주 스코츠데일

또 다른 이벤트

IEMT 2024

ISES SEA 2024

Advanced Packaging Conference 2024