Amkor Technology and J-Devices invites you to join us at the 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC2018) in Tokyo, Japan on April 17th -21st, 2018.

J-Devices will be presenting “Semiconductor Package Technologies in J-Devices for Automotive Application” on April 20th at 15:30 during the FD4: Power Electronics Integration-2 session.

When: April 17, 2018 - April 21, 2018 장소: 일본 도쿄 Location: Hotel Hanamizuki

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