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EPTC 2026

Amkor Technology will participate in the 28th IEEE Electronics Packaging Technology Conference (EPTC 2026) as a Bronze Sponsor, a premier international conference covering the full spectrum of electronics packaging technologies and advanced manufacturing innovation. The event will take place December 1-4, 2026, at the Sands Expo & Convention Centre in Singapore. EPTC brings together researchers, engineers, technology leaders and industry professionals to exchange knowledge, showcase emerging developments and foster collaboration across the global electronics packaging ecosystem.

At the conference, MiKyoung Choi, Senior Director, Product Development, will present “RIE-Enabled Single-Step Selective EMI Shielding for High-Reliability mmWave SiP Applications,” and YounGi Kim, Manager, Equipment Engineering Coordination, will present “Investigation of Low-Frequency Ultrasonic Imaging Behavior in Graphene TIM Interfaces Through Frequency-Domain Analysis.” Additional information about both presentations will be provided at a later date.

As a global leader in semiconductor packaging and test services, Amkor is committed to sharing technical expertise, collaborating with industry partners and advancing the innovations that drive progress across the electronics packaging ecosystem while advancing what’s next.