Events

IMAPS DPC 2025

Amkor Technology invites you to attend the IMAPS DPC 2025 in Phoenix, Arizona, at the Sheraton Grand at Wild Horse Pass from March 2-7. Amkor is a Gold Sponsor of this event. We will be exhibiting at Booth #21, and our packaging experts will be on hand to answer questions and discuss your IC packaging needs.

Amkor will participate in the following:

Tuesday, March 4, 11:15-11:45 AM – TA1: Heterogeneous 2D & 3D Integration Track – SESSION: APPLICATIONS

• “Chiplets and Advanced IC Packaging: Evolution and Tradeoffs”
  Mike Kelly, VP, Chiplets/FCBGA Technology Integration (abstract)

Tuesday, March 4, 11:45 AM – 12:15 PM – TA3: Emerging Technologies: Thermal, Automotive/High Reliability, Photonics/Optoelectronics Track – SESSION: DESIGN FOR QUALITY

• “Firewalls in Semiconductor Assembly“
  Prasad Dhond, VP, Wirebond BGA & MLF Products (abstract)

Tuesday, March 4, 4:00 PM – 4:30 PM – TP2: Fan-Out, Wafer Level & Flip Chip Packaging Track

• “A Novel Package Structure for Enhancing Power Integrity Performance and Cost Efficiency“
  MinWon Park, Dir, Process/Material Research (abstract)

Tuesday, March 4, 4:00 PM – 4:30 PM – TP2: Fan-Out, Wafer Level & Flip Chip Packaging Track

• “A Large Body Lidded FCBGA Thermal Performance Study with Indium-Silver Alloy TIM“
  YoungDo Kweon, Sr. Dir, Chiplets/FCBGA Technology Integration (abstract)

Tuesday, March 4, 4:00 PM – 4:30 PM – TP4: Emerging Technologies: MEMS/Sensors, Additive Manufacturing, mmWave/RF, 5G/6G/High Frequency, Glass Track

• “Small Form Factor MEMS & Sensor Packages“
  Lawrence Natan, Sr. Manager, MEMS and Sensor BU (abstract)

Tuesday, March 4, 4:00 PM – 4:30 PM – TP4: Emerging Technologies: MEMS/Sensors, Additive Manufacturing, mmWave/RF, 5G/6G/High Frequency, Glass Track

• “A New Optical Packaging Platform for Automotive Optical Sensors“
  Weilung Lu, Sr. Director, MEMS and Sensor BU (abstract)

Tuesday, March 4, 5:30 PM – 7:30 PM – IMAPS Poster Session Happy Hour 

• “Metal TIM for Advanced FCBGA Packages“
  Chandrashekhar Pendyala, Director, Chiplets/FCBGA Integration (abstract)