Events

ASPS 2025

Amkor Technology is pleased to invite you to the Advanced Semiconductor Packaging & Chiplet Show (ASPS) 2025, taking place on August 27-29 in Suwon, South Korea, at the Suwon Convention Center.

YoungDo Kweon, Sr Director, Chiplets/FCBGA Development, will present “Power and Thermal Management in Advanced Chiplet-Based Packaging.“ His presentation will examine thermal management solutions, including high-k indium alloy TIM materials, to address AI power density challenges and prevent performance-degrading thermal throttling.