活动

SEMICON West 2025

Amkor Technology 很荣幸成为 SEMICON West 2025 的银级赞助商，该展会将于 10 月 7 日至 9 日在亚利桑那州凤凰城的凤凰城会议中心举行。

CEO Keynote

“Shaping the Future of Semiconductors in the U.S.”
The keynote will explore the rapid transformation of the semiconductor industry, emphasizing the pivotal role of advanced packaging and AI-driven innovation in propelling market growth toward $1 trillion by 2030. The presentation highlights Amkor’s leadership in fostering collaboration, regionalization, and technological advancement to support a robust and secure semiconductor ecosystem in the U.S.
Presenter: Giel Rutten, President and Chief Executive Officer
Date & Time: Wednesday, October 8 | 10:45–11:10 am MT

Industry Panel

“Experiences Setting Up Semiconductor Facilities in the U.S.”
Join semiconductor industry leaders from Amkor Technology, ASML, and ASM for an insightful discussion on building semiconductor facilities in the U.S.
Panelist: David McCann, Senior Vice President of Business Services
Date & Time: Wednesday, October 8 | 3:50–4:35 pm MT

技术海报展示

“High Performance Compute: Advanced Packaging Impacts to Test Equipment”
This poster presentation will spotlight the thermal and test challenges posed by chiplet-based high-performance compute packages. These packages integrate multiple die types—processor, I/O, HBM, and AI accelerators—each with distinct thermal and fabrication requirements. The session will address Active Thermal Control (ATC) needs, the impact of hybrid bonding and micro-pad technologies on wafer-level test, and the evolving role of package handlers in the test workflow.
Presenters: Vineet Pancholi, Senior Director of Manufacturing Test Technology, and Youngsoo Lee, Senior Director of Test Business Development
Date & Time: Wednesday, October 8 | 3:10–5:00 pm MT

Technical Presentation

“Manufacturing Test Challenges for Co-Packaged Optics”
Presenter: Vineet Pancholi, Senior Director of Manufacturing Test Technology
Date & Time: Thursday, October 9 | 2:00–2:15 pm MT

欢迎参加 SEMICON West 2025，与我们的专家团队面对面交流，深入了解我们在半导体封装和测试服务领域的最新创新。