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ISAPP 2025

Amkor Technology Japan is pleased to participate in the 2nd International Symposium on Advanced Power Packaging (ISAPP2025), taking place November 5–7, 2025, at the Fukuoka International Congress Center in Fukuoka, Japan.

Mr. Shinji Baba, head of the Amkor Technology Japan R&D Center, will present “Amkor’s R&D Activities and Power Packaging Roadmap.” Mr. Baba will highlight ATJ’s leadership in developing advanced power packaging technologies, focusing on high-efficiency, high-reliability solutions for automotive, industrial, and energy applications. His talk will also detail ATJ’s current roadmap for next-generation power packaging and discuss how Amkor’s ongoing investment in R&D supports technological innovation and strengthens Japan’s role in the global semiconductor ecosystem.

We invite attendees to connect with the Amkor team to discuss the latest packaging technologies and explore opportunities for collaboration at ISAPP2025.