活动

IMPACT 2024

Amkor Technology invites you to join us at the IMPACT 2024 Conference in Taipei, Taiwan at the Taipei Nangang Exhibition Center on October 22-25. IMPACT 2024, which is organized by IEEE-EPS-Taipei, iMAPS-Taiwan, ITRI, and TPCA, is the largest gathering of PCB and IC packaging professionals in Taiwan.

Amkor will be participating as follows:

• Danny Lee, Principal Engineer, will present his poster “Optimization Via Impedance Feature Under High Density Fan-out Package Structure“
• Peater Wu, Sr. Manager APD, will present “Co-design Optimization for PI and SI When Considering Thermal Performance