活动

2018 年 Automotive World

Amkor Technology and J-Devices invite you to join us at the 18th IC Packaging Technology Expo and Automotive World 2018, Wednesday, January 17th through Friday, January 19th at the Tokyo Big Sight in Japan.

Visit our exhibit at Booth E-37-4 for details on our extensive portfolio of advanced packaging technologies. Both Amkor and J-Devices have the experience and expertise necessary to meet the stringent demands of the automotive market as well as a broad range of semiconductor companies.

If you are planning on attending this event, we welcome the opportunity to meet with you and discuss your future product development and service needs.