English
한국어
日本語
简体中文

Document Library
Factory Certs
Investors
Cloud Services
Careers
Contact Us

MENU

About Us
- Amkor Overview
- Mission
- Company History
- Leadership
- Careers
  - China
  - France
  - Germany
  - Japan
  - Korea
  - Malaysia
  - Philippines
  - Portugal
  - Singapore
  - Taiwan
  - United States
  - Vietnam
- Smart Manufacturing (I4.0)
- ESG
- News
  - Blog
  - Press Releases
- Events
- Customer Center
- Investors
- Memberships and Partnerships
- Contact Us
Packaging
- Laminate
  - CABGA/FBGA
  - DSMBGA
  - FCBGA
  - fcCSP
  - FlipStack^® CSP
  - Interposer PoP
  - PBGA/TEPBGA
  - Stacked CSP
- Leadframe
  - ePad LQFP/TQFP
  - ePad TSSOP/SOIC/SSOP
  - LQFP
  - MicroLeadFrame^®
  - MQFP
  - SOIC
  - SOT23/TSOT
  - SSOP/QSOP
  - TQFP
  - TSSOP/MSOP
- Memory
- MEMS and Sensors
- Power
  - D2PAK (TO-263)
  - DPAK (TO-252)
  - HSON8
  - LFPAK56
  - PowerCSP™
  - PQFN
  - PSMC
  - SO8-FL
  - SOD123-FL
  - SOD128-FL
  - TO-220FP
  - TOLL
  - TSON8-FL
- System in Package (SiP)
- Wafer Level
Technology
Test Solutions
Services
Applications
Quality

Blog

Amkor’s latest news and blogs

Home
|
Events

Showing Events

Connect with us
Sign up for email updates from Amkor

© Copyright 2024 Amkor Technology

ADA Accessibility|
Careers|
Privacy Policy|
Privacy Request|
Legal|
Sitemap|
Contact Us|