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Chiplet Summit 2025

Amkor Technology invites you to the Chiplet Summit 2025 from January 21-23 at the Santa Clara Convention Center in Santa Clara, California. As a proud Bronze sponsor, we are excited to announce that Mike Kelly, our VP of Chiplets/FCBGA Integration, will speak in session E-102: “Best Packaging Methods for Your Application.”

이 세션에는 다음과 같이 반도체 패키징 분야에서 널리 인정 받는 전문가들이 패널로 참여합니다.

• Akshay Singh - 마이크론 첨단 패키징 기술 개발 담당 이사
• Craig Bishop - 데카 테크놀로지 CTO
• Chintan Buch - AMD 기술 스태프 패키징 선임 멤버
• Kenneth Larsen - 시놉시스 제품 관리 수석

Rosalia Beica, Field CTO at Rapidus Design Technologies will moderate the discussion.

Roger St Amand, Corporate vice president of Chiplets/FCBGA, will present “Chiplet Packaging Basics.” This presentation will cover the fundamentals of chiplets and heterogeneous integration and highlight the high-level process flows of Amkor’s 2.5D, S-SWIFT™, and S-Connect™ package technologies.

Vineet Pancholi, Sr Director, Test Technology, will present “Best Practices for Testing 2.5D Chiplet Package Designs.” The presentation will focus on the need for comprehensive test integration throughout development and the continuing significance of system-level testing in manufacturing processes.