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Smart Semiconductor Academy

Amkor Technology will participate in Smart Semiconductor Academy, a technical education and industry engagement forum focused on advanced semiconductor packaging technologies, including HBM and HBF. The event will take place on August 24–26 at Sejong University’s Daeyang AI Center in Seoul, South Korea. Bringing together students, researchers, and industry professionals, the academy provides a platform to explore emerging packaging innovations, technology trends, and real-world semiconductor applications.

As part of the forum, JaeHyeon Seo, Manager, SoC Product Development Division, Amkor Technology, will present “Advanced Packaging and HBM, HBF”. Additional details regarding the presentation abstract will be shared at a later date.

By fostering collaboration across industry and academia, Amkor helps cultivate the next generation of semiconductor professionals, promote innovation in advanced packaging technologies, and strengthen the semiconductor ecosystem while advancing what’s next.