イベント

14th International Conference and Exhibition on Device Packaging

Amkor Technology invites you to join us at IMAPS DPC in Fountain Hills, Arizona at the WekoPa Resort and Casino on March 5-8, 2018.

IMAPS DPCは、IMAPS（International Microelectronics Assembly and Packaging Society）が組織する国際的なイベントです。この会議は、知識交換のための主要なフォーラムであり、これらの分野の第一人者と交流を深めるための技術的、社会的、ネットワーキングの機会を多数提供します。

Amkor is a Gold Premier Sponsor and Exhibitor.

Tuesday, March 6^th
11:00AM – “Multi-die Connectivity and the Proposition for Heterogeneous IC Packaging”, Mike Kelly, VP, Adv Package & Technology Integration
12:00PM – “Innovative Wafer Fan-out Technologies – Heterogenous Integration for a Connected World”, Curtis Zwenger, VP, Adv Package & Technology Integration

Wednesday, March 7^th
10:45AM – “Automotive Packaging: Evolution, Development and Integration”, Shaun Bowers, VP, Mainstream Advanced Package Integration