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KPIA-JKC Packaging Integration 세미나

Amkor Technology invites you to join us at the KPIA-JKC Packaging Integration Seminar on November 6th in Siheung City, Korea at the Technology Innovation Park.

This seminar will cover 3D, SiP, Antenna in Package (AiP), automotive, MEMS & sensor packaging technology.

• ByongJin Kim, Sr. Dir – Advanced Engineering Division Manager at Amkor, will be presenting on “3D, SiP, & Antenna in Package (AiP) Packaging Technology“
• DongSu Ryu, Sr. Dir – Process & Material Project Leader at Amkor, will be presenting on “Automotive Packaging Technology“
• JongDae Jung, Sr. Dir – Master Product Development at Amkor, will be presenting “MEMS & Sensor Packaging Technology“