KPIA-JKC Packaging Integration 세미나
Amkor Technology invites you to join us at the KPIA-JKC Packaging Integration Seminar on November 6th in Siheung City, Korea at the Technology Innovation Park.
This seminar will cover 3D, SiP, Antenna in Package (AiP), automotive, MEMS & sensor packaging technology.
- ByongJin Kim, Sr. Dir – Advanced Engineering Division Manager at Amkor, will be presenting on “3D, SiP, & Antenna in Package (AiP) Packaging Technology“
- DongSu Ryu, Sr. Dir – Process & Material Project Leader at Amkor, will be presenting on “Automotive Packaging Technology“
- JongDae Jung, Sr. Dir – Master Product Development at Amkor, will be presenting “MEMS & Sensor Packaging Technology“
When: November 6, 2019 Where: Technology Innovation Park Location: Siheung City, Korea