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SEMICON Europa

Amkor Technology will be attending the Advanced Packaging Conference (APC), a premier industry event focused on power and interconnect innovations that enable next-generation AI system performance. The event will take place on Wednesday, November 11, at MESSE MÜNCHEN, co-located with electronica.

At the event, Amkor representatives will engage with customers, partners, and industry peers to discuss emerging opportunities and challenges across the semiconductor ecosystem. Discussions will focus on key industry priorities, including AI, advanced packaging, heterogeneous integration, sustainability, and supply chain resilience as organizations work to meet the demands of increasingly complex electronic systems.

Through collaboration, innovation, and deep industry expertise, Amkor remains committed to advancing what’s next across the global semiconductor value chain.