Create highly integrated products with a smaller package and increased functionality

Semiconductor industry demands for higher levels of integration and lower costs coupled with a growing awareness of complete system configuration have continued to drive the popularity of System in Package (SiP) solutions. Amkor’s SiP technology is an ideal solution in markets that demand a smaller size with increased functionality. By assembling, testing and shipping millions of SiP devices per day, Amkor Technology has a proven track record as the industry leader in SiP design, assembly and test.

Amkor’s Center of Excellence for substrate-based SiP technology is located in our largest volume manufacturing facility in ATK4 Kwangju, South Korea. The large-scale manufacturing capabilities in ATK4 factory can achieve significant volume production support with very high yields with short cycle times.

System in Package technology allows multiple advanced packaging technologies to be combined to create solutions customized to each end application. Laminate based SiP technology is in a front-runner solution and most popular SiP solution for cellular, IoT, power, automotive, networking and computing system integrations.

Existing market uses for SiP include:

  • RF and wireless devices
    Power amplifiers, front end module, antenna switch, GPS/GNSS modules, cellular handset and cellular infrastructure, Bluetooth® solutions and 5G NR
  • ウェアラブルおよびマシンtoマシン(M2M)向けのIoT
    Connectivity, MEMS, microcontroller, memory, antenna, PMIC and other mix-mode devices
  • 自動車向けアプリケーション

  • パワーモジュール
  • ロジック、アナログおよびミックスモード技術
  • コンピューティングおよびネットワーキング