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SEMICON Southeast Asia

Amkor Technology invites you to join us at SEMICON Southeast Asia on May 22 – 24, 2018 in Kuala Lumpur, Malaysia at the new Malaysia International Trade & Exhibition Centre (MITEC).

Dr. Jonathan D. Mondero, Sr. Director & ATP-IT Country Manager at Amkor, will be presenting “Fundamental Building Blocks for Your Journey from Smart Manufacturing to Smart Value Chain” on Tuesday, May 22nd at 11:45AM.

Byong-Jin Kim, Sr. Director and R&D Department Manager at Amkor, will be presenting “The Ascendance of Advanced Packaging: The Future is Now” on Tuesday, May 22nd at 2:00PM.

Byong-Jin Kim, Sr. Director and R&D Department Manager at Amkor, will be presenting “Heterogeneous Integration Toolbox for Emerging Applications” on Wednesday, May 23rd at 9:35AM.

Manoharan Gurusamy, Technical Program Manager at Amkor, will be presenting “Growing IoT – From Sensor to SiP MEMS, 3D Sensing and SiP” on Thursday, May 24th at 1:40PM.

Amkor is a proud sponsor of this event.