Packaging for Automotive Electronics Workshop

On February 12, 4:15-5:15 PM, Prasad Dhond, Amkor’s VP and General Manager – Automotive Segment, will participate in a Panel Discussion Focused on Key Reliability Challenges during the TechSearch International “Packaging for Automotive Electronics: Meeting Reliability Challenges for ADAS and Electric Vehicles” in Austin, Texas.

When: February 12, 2019 - February 13, 2019 Where: University of Texas Commons Center Location: Austin, texas


ISES サプライチェーンマネジメント - ライブ・ウェビナー

SEMI - セミコンダクタ・マテリアル・カンファレンス Korea 2021

TSMC 2021 オンライン・テクノロジー・シンポジウム