Packaging for Automotive Electronics Workshop
On February 12, 4:15-5:15 PM, Prasad Dhond, Amkor’s VP and General Manager – Automotive Segment, will participate in a Panel Discussion Focused on Key Reliability Challenges during the TechSearch International “Packaging for Automotive Electronics: Meeting Reliability Challenges for ADAS and Electric Vehicles” in Austin, Texas.
When: February 12, 2019 - February 13, 2019
Where: University of Texas Commons Center
Location: Austin, texas
近日開催予定のイベント
2024年第2四半期 Amkor Technology業績発表に関するカンファレンスコール
IEEE ESTC 2024
