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ICCAD 2024

Join Amkor Technology at the upcoming ICCAD conference on December 11-12 at the Shanghai World Expo Exhibition & Convention Center in Shanghai, China. Amkor will be exhibiting with our packaging experts to answer questions and discuss your IC packaging and test needs.

Oliver Gu, Sr. Director, China Account Manager will present “Advanced Package Platforms for AI/HPC Applications”

概要：

Recently, to overcome the limitations in the device chip design and manufacturing sector, the role of the back-end process – packaging – has been emphasized, and accordingly, a lot of investment is being made by various companies and institutions in the development of various platform solutions. To make large-size and high-efficiency products beyond the role of simple device chip assembly, TaeKyeong will introduce multiple development programs in the packaging sector, share the direction of future development, and present standards for device chip packaging in the future.