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ECTC 2026

Amkor Technology will participate in ECTC 2026, the IEEE Electronic Components and Technology Conference, a leading global forum for electronics packaging, components, and manufacturing technologies. The conference brings together industry experts, researchers, and professionals to share advancements shaping the future of semiconductor packaging and system integration.

As part of the technical program, JongMin Park, Sr. Director, Production Shift Manager at Amkor Korea, will present: “Evaluating Large Body Packaging Performance of Glass Core Substrates for AI and HPC Applications.”

Attendees are invited to visit Amkor at Booth #229 to connect with the team and learn more about Amkor’s packaging and manufacturing capabilities. Amkor looks forward to engaging with the microelectronics community at ECTC 2026 and contributing to broader discussions around advanced packaging technologies.