Amkor Technology invites you to join us at IWLPC on October 23 – 25, 2018 in San Jose, California at the DoubleTree by Hilton San Jose.
IWLPC brings together the semiconductor industry’s most respected authorities to address all aspects of wafer-level, 3D device packaging, advanced manufacturing & test technologies.
Amkor is co-author of:
“Wafer-Level Fan-Out for High-Performance, Low-Cost Packaging of Monolithic RF MEMS/CMOS”
Rameen Hadizadeh, Anssi Laitinen, David Molinero, (WiSpry, Inc.)
Nelson Pereira, Amkor Technology Europe Portugal, (Amkor Technology, Inc.)
Amkor is a sponsor and will be exhibiting at this event with our packaging experts on hand to answer questions and discuss your IC packaging needs.