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IEEE 5G World Forum

Amkor Technology is pleased to be part of the IEEE 5G World Forum event being held in Dresden, Germany on September 30 – October 2.

Mike Kelly, VP, Adv Package & Technology Integration at Amkor Technology, will be present “2.5D TSV: A Path to Heterogeneous Integration” during the panel on Importance of Electronics Packaging and Systems Integration for Success of 5G on Monday, September 30 at 16:30.

The IEEE 5G World Forum and 5G Summit will take a holistic approach to 5G system design, ranging from silicon hardware, wireless interfaces, networks, edge clouds all the way up to Tactile Internet applications. This three-day event offers a unique platform for industry leaders, innovators, and researchers from industry and academia to collaborate and exchange ideas that will help to drive standards and rapid deployment forward.