3D and Systems Summit – SEMI Europe
Amkor Technology invites you to join us at the 3D and Systems Summit – SEMI Europe on January 28-30, 2018 in Dresden, Germany.
Tues. Jan 29th, Session 5: 5G Session, 16:45-17:10
“Heterogeneous Integration – the Future of Packaging“, Steffen Kroehnert, Sr Director – Technology Development.
Amkor will be exhibiting at Booth #14 with our packaging experts on hand to answer questions and discuss your IC packaging needs.
When: January 28, 2019 - January 30, 2019
Where: Dresden Hilton Hotel
開催地：ドイツ、ドレスデン
近日開催予定のイベント
ECTC 2025
IEEE国際インターコネクト技術会議
