Blog

During the IMAPS Symposium 2024, Amkor’s Sr. Director of fcCSP BU, Brendan Wells, appeared on the 3D InCites podcast hosted by Françoise von Trapp. The discussion focused on comparing laminate versus strip-based Substrates in Advanced Packaging, explaining their respective use cases. Wells also shared insights on how chiplet integration is affecting assembly processes in semiconductor packaging.

Additional interviews from MRSI SYSTEMS, Indium, Micross Components, LPKF Laser & Electronics SE, ACM Research, StratEdge, Ajinomoto Fine-Techno USA, Adeia and IBM.