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NEPCON Japan 2025

Amkor Technology invites you to join us at NEPCON Japan 2025, from January 22-24 at the Tokyo Big Sight in Tokyo, Japan. We are thrilled to announce that WonChul Do, VP Fellow and Product Development Group Manager, R&D, will present “Achieving Heterogeneous Integration Through Advanced Packaging: From Connected Devices to Data Centers.”

This presentation will delve into advanced packaging technology, a critical element of system-level innovation in the AI era. Heterogeneous integration through advanced packaging technologies is paving the way for high performance, reduced form factors, and energy efficiency, from data centers to connected devices. Key packaging technologies, trends, and future prospects will be discussed, along with Amkor’s solutions and global manufacturing strategy.