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IMAPS Symposium 2025

Amkor Technology is a proud Keynote sponsor at the IMAPS Symposium 2025 being held in San Diego, California, at the Town and Country Resort from September 29-October 2.

“A New Optical Ball Grid Array Package Development for Automotive Optical Sensors” – WonBae Bang, Sr. Director, SiP Product Development, will discuss innovative OBGA packaging solutions featuring glass lid architecture that prevents particle contamination while meeting AEC-Q100 Grade 2 automotive reliability standards.

“Module Stress Reduction for 2.5D TSV-based Heterogeneous Package” – Hoon Jung, Sr Director, Chiplets/FCBGA BU, will address ANSYS mechanical stress simulation and material optimization strategies for underfill cracking prevention in AI and high-performance computing applications.