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IMAPS DPC 2026

Amkor Technology invites you to attend IMAPS DPC 2026 in Phoenix, Arizona, held at the Sheraton Grand at Wild Horse Pass from March 2 to 5. Amkor is proud to be a Gold Sponsor of this event.

We will be exhibiting at Booth #500 and invite attendees to meet with the Amkor team to discuss our newest packaging and test technologies. Representatives from Amkor Technology Arizona (ATA) will also be at our booth to talk about employment opportunities at our upcoming assembly and test facility in Peoria, Arizona.

앰코는 다음 행사에 참여합니다.

Tuesday, March 3, 2:00-2:30 PM – TP2: Advanced Substrate and Interposer Technologies Track

• “Glass Substrate Design and Signal Integrity Evaluation Compared to Organic Materials in Packaging for 56-112 GHz Applications”
  MinWon Park, Director, RF Module Development (abstract)

Tuesday, March 3, 3:00 PM – 3:30 PM – TP4: Modeling/CPI/Machine Learning/AI/Design Track

• “Cost-Effective High-Performance fcMLF Package Introduction“
  KyungSu Kim, Sr. Director, Wirebond BGA & MLF Products (abstract)

Wednesday, March 4, 1:30 PM – 2:00 PM – WP3: MEMS, Sensors, and Harsh Environment Packaging Track

• “Reengineering Core Packages for Automotive: Materials, Design, and Interconnect Evolution“
  Prasad Dhond, VP, Wirebond BGA & MLF Products (abstract)

Thursday, March 5, 11:00 AM – 11:30 PM – THA2: Thermal Management & Power Delivery Track

• “Thermal Simulation of Direct Die, Single-Phase Liquid Cooling with High Power Density and Surface Area Enhancing Structures“
  Nathan Whitchurch, Director, Engineering (abstract)

Thursday, March 5, 11:00 AM – 11:30 PM – THA3: Advanced Materials & Reliability for High-Performance Packaging Track

• “Suppression of Interfacial Delamination in High-Power Devices by Advanced Adhesion Promoter Coating“
  Hidenori Higashi, R&D Engineering (abstract)