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AEC/APC Symposium Asia 2025

Amkor Technology is pleased to announce participation in the AEC/APC Symposium Asia 2025, taking place November 25–26 at the Fukuoka International Congress Center in Japan.

Mr. Shinji Baba, Vice President of the R&D Center at Amkor Technology Japan, will present “Back-End Technologies for Diversified Semiconductors – Power & CIS.” His presentation will address key areas including package development in Kyushu, innovative functions of semiconductor devices, trends in power device and sensor development, and the rapidly evolving landscape of diversified back-end semiconductor technologies. Attendees will gain insights into Amkor’s leadership in next-generation packaging solutions for both power semiconductors and CMOS Image Sensors (CIS).

Connect with the Amkor team at AEC/APC Symposium Asia 2025 to explore the future of advanced semiconductor packaging and discuss collaboration opportunities within the global semiconductor ecosystem.