Thermal efficiency for high-performance demands
Amkor’s ExposedPad LQFP/TQFP family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. These packages can increase heat dissipation by as much as 110% over standard LQFP/TQFP packages, thereby expanding the margin of operating parameters.
In addition, the ExposedPad can be connected to ground, thereby reducing loop inductance for high frequency applications. The ExposedPad should be soldered directly to the PCB to realize the thermal and electrical benefits. 3D packaging with the die stack process is also provided in this package for the MCP solution.
- ボディサイズ：5 x 5 mm ～ 28 x 28 mm
- リード数：32～256
- 幅広い選択肢のダイパッドサイズ
- ダブル ダウンセット グラウンドボンドリング パッド
- TQFP：ボディ厚1.0 mm
- LQFP：ボディ厚1.4 mm
- リードフレームカスタムデザイン対応
- ExposedPad is easily inverted for heat sink attachment
- 薄型パッケージ： <1.2 mm（取り付け高さ Max）
- Electrical – Very low loop inductance with the use of a paddle as a ground path, more pins available for signal and allows for operating frequencies of up to 2.4 GHz
As increased end-application densities and shrinking product sizes demand more from IC packages, ExposedPad LQFP/TQFP packages provide designers with the necessary margin for designing and producing high-performing products.
Applications such as automotive (engine control units, powertrain and infotainment controllers), LCD/flat panel TVs and telecom benefit from this package. High-speed silicon technologies work especially well in ExposedPad LQFP/TQFP packages due to grounding capabilities.
Amkor devices are assembled in optimized package designs with proven, reliable semiconductor materials.
Commercial Reliability Test
- Moisture sensitivity characterization: JEDEC level 3, 30°C/60% RH, 192 hrs, 3x reflow – SAT
- uHAST w/ precon: 130°C/85% RH, 96 hours f Temp cycle “C” w/ precon: -65°C/+150°C, 500 cycles
- High temp storage: 150°C, 1000 hours
- Qualified to automotive AECQ100 and AECQ006 standards at grade 1 and grade 0 levels
- Die thickness: 11.5 ± .5 mils, 14.5 ± 0.5 mils for LQFP
- Bond pad pitch: 0.050 mm
- Wire diameter: 0.8 mil Cu wire standard
- Lead finish: 100% Matte Sn standard, NiPD PPF frames available
- Marking: Laser
- Pack/Ship options: Barcode, dry pack
- Wafer backgrinding available
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