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Optical Interconnects 2019

Amkor Technology invites you to join us at the Optical Interconnects 2019 on April 24 – 26 in Santa Fe, New Mexico. Amkor’s Mike Kelly, VP, Advanced Package & Technology Integration, will be giving a short presentation and participating in a panel discussion during the Co-Packaged Optics Workshop.

Workshop on Co-Packaged Optics

Co-packaged optics has been a topic of discussion for several years at Optical Interconnects. Previous panels have agreed on the transition from pluggable to co-packaged optics is inevitable to solve the challenges of power, cost, and density facing next generation hyperscale data centers and super-computing. In this years’ workshop, we will dig into some of the issues associated with taking the leap to co-packaged optics.

Topics covered in the workshop will include:

• End-user system requirements
• Thermal and cooling considerations
• Packaging and assembly
• Testing and yield
• Supply-chain ecosystem

Panelists for the workshop discussion:

• Jeff Cox, Microsoft
• Calvin Cheung, ASE
• Peter De Dobbelaere, Cisco
• Mike Kelly、Amkor
• Dan Kuchta, IBM
• Thomas Lilljeberg, Intel