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Chiplet Summit 2025

Amkor Technology invites you to the Chiplet Summit 2025, taking place from January 21-23 at the Santa Clara Convention Center in Santa Clara, California. As a proud Bronze sponsor, we are excited to announce that Mike Kelly, our VP of Chiplets/FCBGA Integration, will be speaking in session E-102: “Best Packaging Methods for Your Application.”

This session will feature a distinguished panel of experts in semiconductor packaging, including:

• Akshay Singh, VP of Advanced Packaging Technology Development at Micron
• Craig Bishop, CTO of Deca Technologies
• Chintan Buch, Senior Member of Technical Staff Packaging at AMD
• Kenneth Larsen, Director of Product Management at Synopsys

The discussion will be moderated by Rosalia Beica, Field CTO at Rapidus Design Technologies.

Additionally, Roger St Amand, Corporate VP of Chiplets/FCBGA, will be presenting “Chiplet Packaging Basics.” This presentation will cover the fundamentals of chiplets and heterogeneous integration, highlighting high-level process flows of Amkor’s 2.5D, S-SWIFT™, and S-Connect™ package technologies.