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Chiplet Summit 2025

Amkor Technology invites you to the Chiplet Summit 2025 from January 21-23 at the Santa Clara Convention Center in Santa Clara, California. As a proud Bronze sponsor, we are excited to announce that Mike Kelly, our VP of Chiplets/FCBGA Integration, will speak in session E-102: “Best Packaging Methods for Your Application.”

このセッションでは、半導体パッケージングの専門家による著名なパネルが含まれます。

• Akshay Singh氏、アドバンスドパッケージング技術開発担当バイスプレジデント、Micron
• Craig Bishop氏、CTO、Deca Technologies
• Chintan Buch氏、テクニカルスタッフパッケージング担当シニアメンバー、AMD
• Kenneth Larsen氏、製品管理担当ディレクター、Synopsys

Rosalia Beica, Field CTO at Rapidus Design Technologies will moderate the discussion.

Roger St Amand, Corporate vice president of Chiplets/FCBGA, will present “Chiplet Packaging Basics.” This presentation will cover the fundamentals of chiplets and heterogeneous integration and highlight the high-level process flows of Amkor’s 2.5D, S-SWIFT™, and S-Connect™ package technologies.

Vineet Pancholi, Sr Director, Test Technology, will present “Best Practices for Testing 2.5D Chiplet Package Designs.” The presentation will focus on the need for comprehensive test integration throughout development and the continuing significance of system-level testing in manufacturing processes.