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ISIG Executive Summit USA

Amkor will be attending the ISIG Executive Summit USA, a senior‑level forum that convenes executives and decision‑makers from across the global semiconductor ecosystem. The summit focuses on strategic insights into market trends, technology roadmaps, supply chain dynamics, and the business challenges shaping the future of the industry.

Throughout the two‑day event, Amkor team members will be on-site, engaging with industry leaders and partners to exchange perspectives on advanced semiconductor packaging, test solutions, and manufacturing enablement.

Amkor will also be represented on a featured panel discussion moderated by Dr. Hamid Azimi, SVP, Advanced Packaging & Foundry at Marvell Technology. The panel includes:

• Suresh Jayaraman, Sr. Director, Package Development, Amkor Technology
• Dr. Rahul Manepalli, Intel Fellow & VP, Advanced Packaging Technology Development, Intel Corporation
• Sriram Srinivasan, Partner, Silicon Package Technology, Microsoft
• Dr. Ravi Agarwal, Director, Advanced Technology Development, Meta
• Dr. Akshay Singh, VP, Advanced Packaging Technology Development, Micron Technology

We look forward to connecting at ISIG to discuss how Amkor’s advanced packaging and test expertise can support your semiconductor technology roadmap and business objectives.