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IEEE国際インターコネクト技術会議

Amkor Technology invites you to join us at the IEEE International Interconnect Technology Conference on June 2-5, 2025, in Busan, South Korea. The event will be held at the Westin Josun Busan Hotel.

SeokHo Na, Sr. Director of Product Development at Amkor Korea, will present “Advanced Interconnection Technology Overview“.

His presentation will examine three established flip chip bonding technologies—mass reflow (MR), thermocompression bonding (TCB), and laser-assisted bonding (LAB)—while introducing Amkor’s innovative reverse laser-assisted bond (R-LAB) and reverse laser thermocompression bond (R-LTC) technologies.