採用情報ーMalaysia

職務上の責任：

• Develop and implement strategies to optimize facility layout and utilization
• Analyze space usage and identify improvement opportunities
• サイト全体のキャパシティ時間調査とラインバランシングの実施
• ランプアッププロジェクトにおけるキャパシティの分析とシミュレーション
• Lead operation team for machine utilization increment projects
• データおよびレポートの自動化プロジェクトのためのIEおよび自動化チームを率いる
• サイトのデータ精度の分析と監視を担当
• Collaborated with the R&D & Finance team in simulating new business equipment and tool requirements

要求事項：

• Candidate must possess at least a Degree in Engineering or equivalent
• At least 3 years of working experience in the related fast-paced manufacturing environment is required for this position
• Knowledge in layout and capacity planning, utilization analysis and IE improvement tools as an added advantage
• Proficient in AutoCAD and Microsoft Office (Excel, PowerPoint)
• 整理された考えを持ち、詳細事項に特別な注意を払いながらシステマティックに対応し、また、問題解決にも優れていること
• 新卒者の応募も歓迎
• 応募者は、セランゴール州Telok Panglima Garang（FIZ）での勤務を受け入れる必要あり

ご希望の方は履歴書を Recruitment@amkor.comまでお送りください

職務上の責任：

• Plan, lead and manage package and process improvement and development activities
• Review customers’ new product spec requirements and follow up implementation where applicable
• Research, evaluate and propose materials and equipment suitable to support new product development
• Study and identify department staff’s technical skill requirements
• Effectively communicate company /department direction to respective staff in the department
• Follow up department staff’s compliance on quality, environmental, safety and health programs and activities in the company
• Performs any other functions and activities as may be assigned by supervisor from time to time

要求事項：

• Candidate should possess at least a Masters/Bachelor’s Degree in Engineering (Mechanical/Electrical/Electronics/Microelectronics/Mechatronics/Semiconductor Technology, Material science) or equivalent
• Preferably more than 10 years in semiconductor backend (FOL & EOL) manufacturing/NPI/process & package development experience
• Experienced in lead frame/power packaging design and technology
• Experienced in semiconductor backend material, equipment, process & package development & project management
• 業界に共通する設備／技術に精通し、新規パッケージ開発に必要な設備機能に関して、優れたノウハウを保持していること
• Design/simulation/FA hands-on experience will be an added advantage
• Good in critical thinking and systematic problem-solving skills e.g. DOE, 8D, DMAIC, Process Mapping, FTA, 5-Why, Fish Bond, IS-IS NOT, etc.
• Good leadership, written and verbal presentation skills in English. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings
• 応募者は、セランゴール州Telok Panglima Garang（FIZ）での勤務を受け入れる必要あり

ご希望の方は履歴書を Recruitment@amkor.comまでお送りください

職務上の責任：

• Source materials and equipment that meet the required quality standards at the most competitive prices
• Negotiate with suppliers and lead cost-reduction initiatives to achieve defined cost-saving targets
• Develop and execute material requirement planning (MRP) to ensure timely and uninterrupted supply of materials
• Oversee inventory management to maintain optimal stock levels while minimizing excess and obsolescence
• Manage vendor relationships, including conducting audits, evaluating performance, and driving continuous improvement programs
• Collaborate with the business development team to support new projects from a procurement perspective
• Oversee Supplier Product Change Notifications (SPCN) to ensure smooth transitions and minimal impact on production
• Lead and mentor the procurement team to achieve departmental KPIs and contribute to overall company goals

要求事項：

• A Bachelor’s Degree in Engineering or a related field is required
• Minimum of 10 years of relevant procurement experience, preferably within the Semiconductor OSAT or multinational corporation (MNC) environment
• Proven expertise in vendor management with excellent communication and relationship-building skills
• Proficient in SAP, particularly in the Materials Management (MM) module
• Strong negotiation skills with a demonstrated track record of successful cost-reduction strategies
• In-depth knowledge of material requirement planning (MRP) and inventory management best practices
• Strong analytical skills and a high level of numerical proficiency
• Proficient in Microsoft Office, particularly Excel and PowerPoint
• Highly organized, systematic, and detail-oriented with strong problem-solving abilities
• Willingness to work in Telok Panglima Garang (FIZ), Selangor

ご希望の方は履歴書を Recruitment@amkor.comまでお送りください

職務上の責任：

• Managing the execution of the new package development project according to business process guidelines, to meet project milestones, quality & cost requirements
• Plan, organize and control the project with full responsibility for all operational decisions in the project
• Responsible for Engineering Samples, Qualification and safe launch builds, and proper handover to manufacturing
• Break down the project complexity to transparently report the status of the project to the project owner, and upper management and diligently to customers
• Prepare respective business cases and forward-looking risk assessments timely to facilitate management decisions and consequence management
• Responsible for overseeing customer audits and all issues related to the projects. Communicate effectively to gain support from all stakeholders

要求事項：

• Minimum 3 years working experience as Project Leader in Semiconductor Package Development
• Broad knowledge of overall Semiconductor FOL and EOL manufacturing processes
• Familiar with the development of Power packages (PQFN, TOLL, LFPAK, etc) an added advantage
• Excellent Project Management, Organizational and Interpersonal Skills in managing semiconductor new package development projects
• Ability to prioritize multiple activities and make effective decisions in support of a compact project plan, using sound communication skills, influencing power and negotiation skills both internally and externally with all stakeholders
• 文書および対話を通じての、優れたプレゼンテーションスキルチームミーティングや経営陣による検討会議などの場で、確信をもってアイデア、コンセプト、データ、そして計画をプレゼンできること
• 応募者は、セランゴール州Telok Panglima Garang（FIZ）での勤務を受け入れる必要あり

Education:

• Bachelor’s or Master’s in Engineering (Mechanical, Electrical, Electronics, Microelectronics, Mechatronics, Semiconductor Technology, Material science) or equivalent.

ご希望の方は履歴書を Recruitment@amkor.comまでお送りください

職務上の責任：

• 異常ロットの処理、故障分析方法の決定、結果の分析・判断を行い、出荷時の品質リスクを回避するため、顧客とのロット進行に関する良好なコミュニケーションを確立する
• プロセスの生産性および作業効率の改善活動をサポートする
• 関連部門への対応に関する内部監査または外部監査においてチームを主導（品目の閉鎖に関する他の部門サポートとの調整も含む）
• 標準作業手順書（SOP）を確立、改善、維持に責任を持ち、シフト間の操作のばらつきを削減・排除して、製造能力の向上と安定を実現
• 新規導入品目の品質と製造可能性のリスクを管理するための立ち上げ準備を含め、製造ラインに導入された新規変更に対する少量生産（LVM）の管理
• 改善を主導し、プロセスフロー、管理計画、およびリスク管理、改善活動、クレーム、監査結果や内部プロセスからインプットされるFMEAの維持を担当

要求事項：

• 同様の半導体製造、できればテストプロセスを通じたTnFに関して2年以上の同様のリーダーとしての実務経験をお持ちの方を優遇
• 製品を少量生産から大量生産に移行させた経験があれば優遇
• 半導体組立工程全般に関する基本的な知識と車載要件を理解し、最小限の監督下で自立して業務を遂行できる
• 高い分析能力、SPCの問題解決スキル、8つの規律、なぜなぜ分析、フォールトツリー分析、およびDOEに精通しているチームプレーヤーさらに有利
• リーンマニュファクチャリング、シックスシグマ、ISO/TS規格に関する知識と経験
• 新卒者の応募も歓迎
• 応募者は、セランゴール州Telok Panglima Garang（FIZ）での勤務を受け入れる必要あり

Education:

• 候補者は少なくともエンジニアリング（機械、電子、製造、材料工学）または類似の分野の学位か修士号を取得している必要あり
• 新卒者の応募も歓迎

ご希望の方は履歴書を Recruitment@amkor.comまでお送りください