Blog

ECTC 2026 brought together more than 2,700 semiconductor professionals to explore the future of advanced packaging, heterogeneous integration, and high-performance systems. At this year’s conference, Amkor Technology focused on what matters most to customers and partners: scaling advanced packaging technologies, strengthening ecosystem collaboration, and expanding U.S. semiconductor manufacturing capacity.

Driving Advanced Packaging Innovation

Amkor’s booth became a focal point for discussions on advanced packaging solutions enabling AI, high-performance computing (HPC), photonics, and advanced memory applications. Visitors engaged with key platforms including S-Connect™, S-SWIFT™, wafer-level packaging, and co-packaged optics—technologies designed to meet increasing demands for bandwidth, power efficiency, and integration density.

Hands-on package displays helped translate these innovations into real-world applications, prompting deeper conversations around system-level design challenges such as signal integrity, thermal performance, and scalability. Attendees were particularly interested in how Amkor supports the transition from design to high-volume manufacturing.

Collaborations with ecosystem leaders including AMD, Apple, TSMC, and NVIDIA reinforced the importance of tightly aligned partnerships in bringing next-generation semiconductor solutions to market.

Technical Leadership in Practice

Amkor’s technical depth was evident through active participation from its engineering leaders. JongMin Park, Senior Director, Production Shift Manager, presented a poster on glass core substrates for AI and HPC applications, generating strong engagement around emerging substrate technologies and performance scaling.

Suresh Jayaraman, Senior Director, Package Development, and KyungRok Park, Corporate Vice President, Head of Global R&D Center, contributed to in-depth technical discussions with customers and partners. These exchanges focused on solving practical design and manufacturing challenges, underscoring Amkor’s role as both a technology innovator and a production partner.

Expanding U.S. Semiconductor Manufacturing

A central theme throughout ECTC 2026 was the growing importance of domestic semiconductor manufacturing. Amkor Technology Arizona, the company’s new facility in Peoria, was a key point of interest for attendees focused on supply chain resilience and regional capacity.

Discussions highlighted how the Arizona site will support advanced packaging and test services for next-generation devices, helping strengthen the U.S. semiconductor ecosystem while meeting increasing demand for localized manufacturing.

At a sponsored luncheon, Kris Pugsley, Vice President, Marketing Communications, presented on scaling global capabilities to U.S. manufacturing. The session drew a highly engaged audience interested in how advanced packaging capacity is evolving within the United States.

Building the Semiconductor Workforce

Workforce development was another prominent theme, particularly as the industry scales advanced packaging and manufacturing capabilities. Amkor engaged with students and early-career professionals exploring semiconductor career paths, many of whom expressed interest in opportunities connected to the Arizona facility.

These conversations reflect a broader industry priority: building a skilled talent pipeline to support long-term innovation and growth in semiconductor manufacturing.

Strengthening Ecosystem Collaboration

ECTC also provided an important venue for supplier and partner engagement. Amkor held discussions focused on aligning roadmaps, ensuring quality and scalability, and supporting increasingly complex integration requirements.

A strong, collaborative ecosystem remains essential to delivering reliable, high-performance advanced packaging and test solutions at scale.

Looking Ahead

Amkor’s presence at ECTC 2026 reinforced its leadership in advanced packaging, commitment to U.S. semiconductor manufacturing expansion, and focus on ecosystem collaboration. As demand accelerates across AI, HPC, and next-generation applications, Amkor continues to play a critical role in enabling innovation from concept to production.