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A History of Quality

With the knowledge gathered from decades of supporting Tier 1 and emerging industry leaders, Amkor understands that test solutions must address advanced technology, quality, performance and cost of test. Through early engagement in each customer’s product lifecycle, Amkor helps define test strategies and intelligent equipment selection to provide differentiated test solutions.

Amkor provides comprehensive test services that complement wafer-level and package assembly. Amkor is the #1 RF test services supplier for sub-6GHz and has on-going joint efforts with test equipment suppliers and customers to enable 5G product’s production testing. We are also the #1 OSAT supplier for automotive and artificial intelligence (AI) processor testing and have a vast array of test capabilities and rich experience in device testing.

Test Locations

Our sites are strategically located near leading foundries, major customer sites and co-located to support probe with bump/WLCSP and test with assembly

China
Japan
Korea
Malaysia
Philippines
Portugal
Taiwan

Amkor China provides an extensive offering of mainstream and advanced package and test services.

  • Wafer probe/Package test, Film frame test, System-level test
  • Communication, Memory
  • Bumping, FC, CSP, MLF®, PBGA
  • 93K, UFLEX, FLEX, J750, Magnum, T5XXX
  • Test development

Amkor Japan provides customers with immediate access to the Japanese automotive market and is equipped with a large installed test base with burn-in and 100% automated x-ray infrastructure capability.

  • Wafer probe/package test
  • Automotive, Consumer, Memory
  • Flip Chip, PBGA, MLF®/QFN
  • 93K, UFLEX, FLEX, J750, T2K, Magnum, T65XX
  • Test development

Amkor Korea provides an extensive offering of mainstream and advanced package and test services and is home to our R&D Center.

  • Wafer probe/package test, Film frame test, System-level test
  • Automotive, Consumer, Communication
  • Bumping, Flip Chip, CSP, MLF®/QFN, TSV, TMV®, TQFP
  • Z3K, UFLEX, FLEX, J750, T55XX, T2K
  • Test development
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Amkor Portugal offers in-house capabilities for the entire development chain, from design to multiple WLP technologies, and the flexibility to tailor and test solutions that respond to the most demanding customer requirements.

  • Wafer probe
  • Communication, Memory experience, RF
  • WLFO
  • UFLEX RF, Rack & Stack, T5XXX
  • Test development
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Test Development Engineering at Amkor

Some customers develop their own complete test solutions and offload to Amkor for production. Amkor can enable co-development, or full development, of complete test software and hardware solutions. Engage with us early in the product design for maximum impact, or come to us later in the product lifecycle for significant cost savings with migrations to more cost-effective testers and/or higher parallelism.

Working collaboratively with customers, Amkor ensures:

  • Novel low cost
  • One-stop accountability
  • Turnkey with bump and assembly

Whether a customer needs to bring up NPI or reduce costs and achieve higher throughput, Amkor offers full-service test development and draws upon a large existing tester fleet. New testers are only recommended as a last resort.

Test Equipment

Amkor has an extensive equipment fleet and continues to invest in new capabilities required to test the latest devices

Probe (Wafer Sort)
Burn-in (BI)
Final Test (FT)
System-Level Test (SLT)
Backend Test

Testers:

  • Teradyne
  • Advantest
  • COHU

Wafer Test:

  • Bare (pad)
  • Bump, WLCSP
  • CoW, WoW, LoCoW, molded CoW
  • SWIFT®, interposer

Wafer-level test for wafer fabrication defects

Prober:

  • Semics
  • TSK
  • TEL

Specifications:

  • Size: 8″ & 12″ with 14, 10, 7 and 5 nm process technologies
  • Thickness: 300 to 2,200 µm
  • Die size: 600 to 76,000 µm
  • Temperature: -55~150°C

Burn-in tester/handler (oven)

Burn-in loader/unloader

Packaged parts at present; may consider wafer-level burn-in in the future

Trap infant mortality

Stress – voltage, temperature

Measure V minimum degradation at FT

Burn-in vs. bake

Test conditions:

  • Power delivery
  • Power and thermal management for BIT duration, with a control loop
  • Targeted content to weed out manufacturing defects

Testers:

  • Teradyne
  • Advantest
  • Cohu
  • National Instruments

Broad package range:

  • Strip
  • Film
  • Singulated

Handlers:

  • Gravity, memory, PnP, strip, turret
  • Load board features:
    • Complex & cost-effective FR4 to specialty
    • Low- to high-speed & analog/RF
  • Test contactor
  • Temperature:
    • Cold (-50°C)
    • Hot (160°C)

Tester & Handler:

  • Chroma
  • Hontech
  • Multi-Test
  • Teradyne

Test Board Size:

  • 200 x 380 mm

Automatic Temperature Control:

  • 50°C to 125°C

Package Size:

  • 5 x 5 to 25 x 25 mm

Parallelism:

  • 16 to 320, depending on handler type and package size

Fully customizable backend processes:

  • Post marking is optional; Bake is determined based on Moisture Sensitivity Level (MSL)
  • For small turret handler packages, the FT & Scan & TnR packing is done sequentially
  • In case of BGA/QFP, etc. with typically >3 mm in dimension at generic PnP handler, requires bake and packing (either tape & reel and tray)

Advanced solution for advanced packing:

  • Package-on-Package (PoP)
  • Through Silicon Vias (TSV)
  • fcCSP
  • FCBGA

Applications

Questions?

Contact an Amkor expert by clicking the request info button below.

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