탁월한 RF 전기적 성능
앰코의 FusionQuad®(VQFP / HVF-PQFP) 기술은 ExposedPad TQFP (Thin Quad Flat Package)와 MicroLeadFrame® 기술의 효과적인 통합을 통한 leadframe 기반 패키징의 획기적인 발전의 전형입니다.
FusionQuad technology extends the I/O range of classic leadframe packaging to nearly 400 unique pins and delivers an approximate 50% reduction in package size for a given lead count. Additionally, these packages provide excellent RF electrical performance characteristics with short signal paths to the bottomlands and high-power dissipation capability with the solderable exposed die attach paddle. The novel integration of bottom lands in a Quad Flat Package (QFP) provides a cost-effective platform for an increased lead count in a small form factor.
Amkor’s FusionQuad provides an ideal package format for most IC semiconductor technologies including advanced mixed-signal SoCs, MCUs, ASICs, DSPs and a variety of others. These packages are particularly well suited for applications requiring superior electrical or thermal performance in a cost-constrained environment including storage, PCs, communications, automotive and many others.
- 10 x 10mm에서 24 x 24mm의 패키지 크기
- Increased I/O (116–356) in smaller package footprints
- Copper leadframe 기반
- Integrated exposed die attach
- 제품 두께 0.8mm & 1.0mm
- 무연, 친환경
- 최적의 전기적, 열적 성능을 위한 유연한 설계
Q & A
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