With the knowledge gathered from decades of supporting Tier 1 and emerging industry leaders, Amkor understands that test solutions must address advanced technology, quality, performance and cost of test. Through early engagement in each customer’s product lifecycle, Amkor helps define test strategies and intelligent equipment selection to provide differentiated test solutions.

Amkor provides comprehensive test services that complement wafer level and package assembly. Amkor is the #1 RF test services supplier for sub-6 GHz and has ongoing joint efforts with test equipment suppliers and customers to enable 5G product’s production testing.

We are also the #1 OSAT supplier for automotive and artificial intelligence (AI) processor testing and have a vast array of test capabilities and rich experience in device testing.

Test Equipment

Amkor has an extensive equipment fleet and continues to invest in new capabilities required to test the latest devices

Probe (Wafer Sort)
Burn-in (BI)
Final Test (FT)
System-Level Test (SLT)
Backend

Testers:

  • Advantest
  • COHU
  • Teradyne

Wafer Test:

  • Bare (pad)
  • Bump, WLCSP
  • CoW, WoW, LoCoW, molded CoW
  • SWIFT®, interposer

Wafer-level test for wafer fabrication defects

Prober:

  • Semics
  • TSK
  • TEL

Specifications:

  • Size: 8″ & 12″ with 14, 10, 7 and 5 nm process technologies
  • Thickness: 300 to 2,200 µm
  • Die size: 600 to 76,000 µm
  • Temperature: -55~150°C

Burn-in tester/handler (oven)

Burn-in loader/unloader

Packaged parts at present; may consider wafer-level burn-in in the future

Trap infant mortality

Stress – voltage, temperature

Measure V minimum degradation at FT

Burn-in vs. bake

Test conditions:

  • Power delivery
  • Power and thermal management for BIT duration, with a control loop
  • Targeted content to weed out manufacturing defects

Testers:

  • Teradyne
  • Advantest
  • Cohu
  • National Instruments

Broad package range:

  • Strip
  • Film
  • Singulated

Handlers:

  • Gravity, memory, PnP, strip, turret
  • Load board features:
    • Complex & cost-effective FR4 to specialty
    • Low- to high-speed & analog/RF
  • Test contactor
  • Temperature:
    • Cold (-50°C)
    • Hot (160°C)

Tester & Handler:

  • Chroma
  • Hontech
  • Multi-Test
  • Teradyne

Test Board Size:

  • 200 x 380 mm

Automatic Temperature Control:

  • 50°C to 125°C

Package Size:

  • 5 x 5 to 25 x 25 mm

Parallelism:

  • 16 to 320, depending on handler type and package size

Fully customizable backend processes:

  • Post marking is optional; Bake is determined based on Moisture Sensitivity Level (MSL)
  • For small turret handler packages, the FT & Scan & TnR packing is done sequentially
  • In case of BGA/QFP, etc. with typically >3 mm in dimension at generic PnP handler, requires bake and packing (either tape & reel and tray)

Advanced solution for advanced packing:

  • Package-on-Package (PoP)
  • Through Silicon Vias (TSV)
  • Flip Chip CSP (fcCSP)
  • Flip Chip BGA (FCBGA)

Test Locations

Our sites are strategically located near leading foundries, major customer sites and co-located to support probe with bump/WLCSP and test with assembly

中国
日本
韓国
マレーシア
フィリピン
ポルトガル
台湾

Offerings:

  • Wafer probe
  • Package test
  • Film frame test
  • System-level test
  • Test development
  • Bumping

Test Equipment:

  • 93K
  • UFLEX
  • FLEX
  • J750
  • Magnum
  • T5XXX

Packages:

  • フリップチップ
  • CSP
  • MLF®
  • PBGA

Markets:

  • Communication
  • メモリ

Offerings:

  • Wafer probe
  • Package test
  • Test development

Test Equipment:

  • 93K
  • UFLEX
  • FLEX
  • J750
  • Magnum
  • T2K
  • T65XX

Packages:

  • フリップチップ
  • PBGA
  • QFN

Markets:

  • 自動車向け
  • Communication
  • メモリ

Offerings:

  • Wafer probe
  • Package test
  • Film frame test
  • System-level test
  • Test development
  • Bumping

Test Equipment:

  • 93K
  • UFLEX
  • FLEX
  • J750
  • T2K
  • T55XX

Packages:

  • フリップチップ
  • CSP
  • MLF®
  • TQFP
  • TMV®
  • TSV

Markets:

  • 自動車向け
  • Communication
  • 民生品

Offerings:

  • Package test

Test Equipment:

  • CATS
  • ITS
  • TESEC
  • Tsuruga

Packages:

  • SO8-FL
  • SONXXX-FL
  • TO-220FP
  • TQFP
  • TSON-FL

Markets:

  • Discrete
  • Power

Offerings:

  • Wafer probe
  • Package test
  • Film frame test
  • System-level test
  • Test development
  • MEMS Test
  • Burn-in

Test Equipment:

  • 93K
  • FLEX
  • J750
  • T2K
  • Magnum
  • ETS
  • FLEX
  • LTX
  • D10
  • ASLX

Packages:

  • MLF®
  • リードフレーム
  • QFP

Markets:

  • 自動車向け
  • 民生品
  • メモリ

Offerings:

  • Wafer probe
  • Test development

Test Equipment:

  • UFLEX RF
  • Rack & Stack
  • T55XX

Packages:

  • WLCSP/li>
  • WLFO

Markets:

  • Communication
  • メモリ

Offerings:

  • Wafer probe
  • Package test
  • Film frame test
  • Bumping

Test Equipment:

  • 93K
  • UFLEX
  • FLEX
  • J750
  • T2K
  • T6XXX
  • ETS
  • LTX
  • STS

Packages:

  • フリップチップ
  • WLCSP

Markets:

  • Communication
  • 民生品
  • ネットワーク

Test Development Engineering

Amkor can enable co-development, or full development, of complete test software and hardware solutions. Engage with us early in the product design for maximum impact, or come to us later in the product lifecycle for significant cost savings with migrations to more cost-effective testers and/or higher parallelism.

Working collaboratively with customers, Amkor ensures:

  • Low cost
  • One-stop accountability
  • Turnkey with bump and assembly

Whether a customer needs to bring up NPI or reduce costs and achieve higher throughput, Amkor offers full-service test development and draws upon a large existing tester fleet. New testers are only recommended as a last resort.

Differentiated Test By Market

Automotive & Industrial

Amkor is the number one automotive OSAT, supporting world-wide supply chains. Products in this area include infotainment and safety requiring high levels of performance. This requires a much more comprehensive set of test requirements.

  • High-quality, standards-compliant processes and systems
  • Inspections and tri-temperature multi-temperature test capabilities
    • Wafer probe at -55°C to +200°C
    • Final test at -55°C to 175°C
    • Burn-in
    • System Level Test (SLT)
  • Cold wafer probe and perform room & hot temperature final test
  • Post assembly final test with outgoing post assembly opens/shorts testing, includes 2 and 4 wire resistance tests
通信機器

Over 40% of Amkor’s revenue is derived from Communications (smartphones, tablets, handhelds and wearable devices). Our leading edge test solutions keep pace with rapid changes in cellular and connectivity technology requirements. Amkor is already well positioned for 5G wireless and its new test requirements – working with leading customers and ATE suppliers, we have 5G RF test capability in place.

  • RF wafer probe capabilities – known good die (KGD) for WLCSP and known tested die (KTD) for SiP
  • Multi-site x8 RF test to lower cost
  • ATE coverage with SLT (protocol test)
  • Complex SiP with simple SLT, including RF callbox testing
  • SoC + Memory PoP – double side test/stack CSP – memory and logic test
  • ATE w/32 port and multi-site, multi-channel Tx & Rx support
  • Local RF shielding ≤60 dBm
  • RF Front End (RFFE), SiP & IoT
  • Asynchronous test for different RF connectivity standards
  • Single and multiple channel beam forming, phase array, AiP/AoP support
Artificial Intelligence, Networking & Computing

Amkor is a leading provider of high-performance test solutions for the demanding networking and computing market – where five nines (99.999%) or higher uptime is expected. We have multiple customers supplying SiP(s), SoC(s) and components into these markets (servers, routers, switches, PCs, laptops and peripherals). Integral to these markets are storage technology and migrations from hard disk drives to solid state drives (SSD). In addition, Amkor has a strong array of NAND test capabilities.

  • Distributed test (wafer probe, in-situ test between key assembly steps and final test (SLT and ATE) for 2.5D)
  • Active thermal control for 300-watt products across tri-temperature in SLT and ATE test
  • Probe solutions and wafer map management for chip on wafer (CoW)
  • Dynamic burn-in
  • Test during burn-in (TDBI)
  • Film frame and strip test (x308 EEPROM)
  • High-speed serial digital (e.g. PCIe Gen4, Gen5) testing up to 16 Gbps and 32 Gbps
Power/Discretes

Amkor is a world leader in power discrete devices, with test services that are closely integrated with assembly flow for shorter cycle times and reduced costs. Unique requirements include:

  • High current, high voltage
  • Adequate thermal capacity
  • Kelvin contact-type tests
  • Low Rds_on

High-volume products at Amkor include:

  • Intelligent power modules
  • Multi-voltage FETs
  • Flip chip MOSFETs
  • Insulated-Gate Bipolar Transistors (IGBT)
  • Diodes
  • Regulators and bipolar transistors for the automotive, power transmission and industrial segments
Sensors & Actuators (MEMS)

Products for today’s Internet of Things (IoT) require an MCU, RF transmitter/receiver, sensors and actuators. The test solution needs to cover conversion of physical real- world analog signals into electrical data and processing of the data to determine if the product is good or not.

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