卓越的 RF 电气性能

Amkor 的 FusionQuad® (VQFP/HVF-PQFP) 技术有效集成薄型四方扁平封装 (TQFP) 和 MicroLeadFrame® (MLF) 技术,是一项基于引脚框架塑料封装的突破性技术。

FusionQuad technology extends the I/O range of classic leadframe packaging to nearly 400 unique pins and delivers an approximate 50% reduction in package size for a given lead count. Additionally, these packages provide excellent RF electrical performance characteristics with short signal paths to the bottomlands and high-power dissipation capability with the solderable exposed die attach paddle. The novel integration of bottom lands in a Quad Flat Package (QFP) provides a cost-effective platform for an increased lead count in a small form factor.

Amkor’s FusionQuad provides an ideal package format for most IC semiconductor technologies including advanced mixed-signal SoCs, MCUs, ASICs, DSPs and a variety of others. These packages are particularly well suited for applications requiring superior electrical or thermal performance in a cost-constrained environment including storage, PCs, communications, automotive and many others.

特色

  • 10 x 10 毫米至 24 x 24 毫米封装尺寸
  • 在更小的封装面积内增加 I/O 数量 (116–356)
  • 基于铜引脚框架
  • 集成外露晶粒贴装
  • 0.8 毫米和 1.0 毫米封装厚度
  • 无铅/绿色
  • 灵活设计以优化电气和热力性能

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