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2004 Press Releases

02/17/2004
Amkor Again Expanding Capacity for MicroLeadFrame(R) Package to Accommodate Customer Demand

02/12/2004
Amkor Technology to Acquire Taiwan Assembly and Test Facility

02/03/2004
Amkor's Power SiP Addresses Thermally Demanding Power Conversion Applications

01/28/2004
Amkor Reports Fourth Quarter 2003 Results

01/22/2004
Amkor Sees Surge in Demand for Advanced Stacked Packages; Plans Aggressive Capacity Expansion in 2004

01/20/2004
Oki Chooses Amkor for Advanced Packaging Solutions

01/15/2004
Amkor Promotes Top Executives

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