Copper (Cu) wire has long been used as a method of connecting a silicon die to the package terminals. With the recent increase in Gold (Au) wire cost, Copper (Cu) wire is an attractive way to manage overall package cost.
Copper (Cu) Wire Benefits
Copper (Cu) wire offers significant cost advantage over Gold (Au) wire. It is also an excellent replacement for Gold (Au) wire due to its similar electrical properties. Self inductance and self capacitance are nearly the same for Gold (Au) and Copper (Cu) wire and Copper (Cu) wire has lower resistivity. In applications where resistance due to bond wire can negatively impact circuit performance, using Copper (Cu) wire can offer improvement.
Wire Material Cost Savings Copper (Cu) versus Gold (Au)
Minimum Bond Pad Size by Wire Diameter (T = Bond Pad Metal Thickness)
Wafer Technology Node and Copper (Cu) Wire Readiness
| > 60nm | 55 / 60nm | 45 / 40nm |
28 / 22nm | |
|---|---|---|---|---|
| Non-Low-K or Low-K | Low-K | Low-K | Ultra Low-K | Ultra Low-K |
| Reliability Status | Customer Qualified | Customer Qualified |
Customer Qualified |
In Process |
| Production Status |
HVM | HVM | HVM | Development |
Package Family and Factory Qualification
| PACKAGE FAMILY |
Cu WIRE HVM PLANT |
|---|---|
| CABGA | C3, K4, P3, J1 |
| LQFP | K1, P1, T1, J1 |
| MicroLeadFrame® (MLF) |
C3, K1, P3 |
| MQFP | P1, T1 |
| PBGA | C3, K4, P3 |
| PDIP |
P1 |
| PLCC | P1 |
| PSOP | P1 |
| SC 70 | P1 |
| STACKED CSP (SCSP) | C3, K4, J1 |
| SOIC | P1 |
| SOT 23 |
P1 |
| SSOP | P1 |
| TQFP | K1, P1, T1, J1 |
| TSSOP | P1 |
For more information on our Copper Wire Bonding services, please contact an Amkor Regional Sales Office near you or fill out the Request for Information Form.