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2011 Press Releases

12/20/2011
Sales of Amkor Technology’s Next Generation Through Mold Via Package-on-Package Solutions Surpass 100 Million Units

11/21/2011
Amkor Technology to Present at Credit Suisse Technology Conference

11/14/2011
Toshiba and Amkor Jointly Agree to Postpone Discussions for Acquisition of Toshiba’s Malaysian Semiconductor Assembly and Test Operations Due to Thailand Flooding

11/04/2011
Amkor Technology Announces Conversion of PBGA Products to Pin-Gate Mold Process

11/02/2011
Amkor Honors Seven Companies with 2011 Supplier Award

10/27/2011
Amkor Technology Reports Third Quarter 2011 Financial Results

10/21/2011
Amkor Technology to Announce Third Quarter 2011 Financial Results on October 27, 2011

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