Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact to the PWB. The package also offers Amkor's ExposedPad technology as a thermal enhancement by having the die attach paddle exposed on the bottom of the package surface to provide an efficient heat path when soldered directly to the PWB. We also offer a Flip Chip MLF® and Dual Row MLF® package.
Amkor offers Wafer Level CSP (WLCSP) to form solder bumps on device I/O pads or to add a copper redistribution layer and route from I/O pads to solder bumps on JEDEC / EIAJ standard pitches. WLCSP is a true chip-scale package, offering the smallest possible footprint. Amkor provides wafer bumping, wafer level test, back grind, dicing, and packing in tape & reel to support a full turn-key WLCSP solution. Amkor is able to integrate its wafer bumping products into high performance packaging options, such as fcCSP & SiP.
Flip Chip Interconnect Packaging Solutions
Demand for flip chip interconnect technology is being driven by a number of factors from all corners of the silicon industry. To support this demand, Amkor is committed to being the leading provider of Flip Chip in Package (FCiP) technology. By partnering with proven industry leaders, Amkor has brought high volume packaging and assembly to the subcontract market. SuperFC®, fcBGA, fcLBGA, FCmBGA and fcCSP are qualified and are in production. Wafer Bumping, WLCSP, and Flip Chip packaging solutions are qualified in lead-free options.
|11/20/13||Amkor Technology to Present at Credit Suisse Technology Conference|
|10/28/13||Amkor Technology Reports Financial Results for the Third Quarter 2013|
|10/21/13||Amkor Technology to Announce Third Quarter Financial Results on October 28, 2013|
|08/27/13||Amkor Technology to Present at Upcoming Conferences|
|Amkor Article in the Fall MEPTEC Report titled, "Trends and Considerations in Automotive Electronic Packaging"