CoC POSSUM™ is a packaging technology designed to assemble two or more dies together without the need for TSV. Amkor’s CoC POSSUM technology uses the existing infrastructures that are readily available, with minimum supplemental capital investment. In the Chip on Wafer (CoW) approach, the daughter (smaller) dies are flip-chip attached to the mother (larger) dies in the wafer format versus to the die format in CoC. Amkor has now been able to support CoC POSSUM builds for 200mm and 300mm wafers, in various applications ranging from ASIC, FPGA, MEMS, microcontrollers and memory devices.
Wafer Level Fan-Out (WLFO) is a package technology designed to provide increased I/O density within a reduced footprint and profile for low density single die and multi die applications at lower costs. Amkor has developed the capability to produce both single die and multi die Wafer Level Fan-Out packages, including 3D configurations. Amkor’s rapid development cycle, robust assembly platform, and quick time to market continue to provide a path to rapid return on its Wafer Level Fan-Out investment.
Through Silicon Via (TSV) Solutions
|06/18/13||Amkor Technology Receives 2012 Supplier of the Year Award from Altera|
|05/20/13||Amkor Technology Completes Sale of $225 Million of Its 6.375% Senior Notes Due 2022|
|05/16/13||Amkor Technology to Present at Barclays 2013 High Yield Bond and Syndicated Loan Conference|
|05/15/13||Amkor Technology Announces Pricing of $225 Million of Its 6.375% Senior Notes due 2022|
|06/23/13||The ConFab 2013|
|07/09/13||SEMICON West 2013|
|09/09/13||Euopean Microelectronics Packaging Conference 2013|
|09/10/13||IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process|
|09/25/13||GSA Executive Forum|
|Joint Altera & Amkor Article in the June issue of CSR titled, "Realizing 3D IC Integration with Face-to-Face Stacking"